Via hole structure of aluminum substrate and demagnetization system based on via hole structure

A via hole structure of an aluminum substrate and a demagnetization system based on the via hole structure comprise the aluminum substrate, a via hole is formed in the front face of the aluminum substrate, the via hole penetrates through the bottom of the aluminum substrate, a bonding pad covers the...

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Bibliographische Detailangaben

Hauptverfasser:	MA XIANYING, YANG XINGZONG, ZHANG JIALU, BI ZONGYI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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