Via hole structure of aluminum substrate and demagnetization system based on via hole structure

A via hole structure of an aluminum substrate and a demagnetization system based on the via hole structure comprise the aluminum substrate, a via hole is formed in the front face of the aluminum substrate, the via hole penetrates through the bottom of the aluminum substrate, a bonding pad covers the periphery of the via hole, copper paste is filled in the via hole, soldering tin is arranged at theupper end of the copper paste, and the soldering tin is arranged in the via hole. And the bonding pad is welded with the copper paste through the soldering tin, and the bottom end of the copper pasteis fixedly connected with an aluminum base at the bottom of the aluminum substrate. The utility model relates to the field of aluminum substrates, which is simple and practical in overall structure,high in economic benefit and suitable for popularization. 一种铝基板的过孔结构及基于过孔结构的消磁系统，包括铝基板，所述铝基板正面开设有过孔，所述过孔贯穿至所述铝基板的底部，所述过孔的周围覆盖有焊盘，所述过孔内部填充有铜浆，所述铜浆的上端设有焊锡，通过所述焊锡将所述焊盘与所述铜浆焊接，所述铜浆的底端与所述铝基板的底部铝基固定连接。本实用新型涉及铝基板领域，整体结构简单实用，经济效益高，适合推广