Bonding die for insulation board

The embodiment of the utility model discloses an insulation board bonding die which comprises a die frame with the upper surface capable of being placed on the back face of an insulation board, a dieplate is arranged in the die frame, and a connecting rib connected with the inner side of the die frame is arranged on the die plate. A square sub-frame groove surrounding the outer side of the formwork is formed between the die frame and the formwork, first limiting holes distributed at equal intervals are formed in the positions, close to the two sides, in the formwork, and a second limiting hole and a third limiting hole are formed in the transverse central axis of the formwork. The part coated with the adhesive on the back surface of the insulation board is positioned by covering the template of the insulation board, and the adhesive points distributed at equal intervals can be formed by controlling the distribution quantity and the distribution parts of the circular adhesive surfaceson the back surface of the