Silicon wafer conveying device for wafer inserting machine

The utility model provides a silicon wafer conveying device for a wafer inserting machine, which comprises a conveying assembly, a hanging frame and a U-shaped material carrying groove, the top of thehanging frame is connected with the conveying assembly, the bottom of the hanging frame is fixedly connected with the U-shaped material carrying groove, a groove opening of the U-shaped material carrying groove faces upwards, and a spray head is fixed at one end, close to the U-shaped material carrying groove, of the hanging frame. The nozzle is communicated with the water pump through a water pipe. The silicon wafer conveying device for the wafer inserting machine solves the problem that feeding cannot be achieved due to the fact that silicon wafers are toppled backwards in the feeding process. 本实用新型提供了一种插片机用硅片传送装置，包括传送组件、挂架、U型载料槽，所述挂架的顶部与所述传送组件相连，底部与所述U型载料槽固定连接，所述U型载料槽槽口朝上设置，所述挂架靠近所述U型载料槽的一端通过固定块固定有喷头，所述喷头通过水管与水泵连通。本实用新型所述的一种插片机用硅片传送装置解决了由于硅片在上料过程中向后方倾倒导致无法上料的问题。