Feeding mechanism and putty applying robot

The embodiment of the invention provides a feeding mechanism. The feeding mechanism comprises a storage device, a baffle, a push plate mechanism, a plurality of sensors and a control device. The storage device is provided with a feeding port and a discharging port, and the baffle is arranged on the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: DENG XIANFEI, ZHAO LILI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The embodiment of the invention provides a feeding mechanism. The feeding mechanism comprises a storage device, a baffle, a push plate mechanism, a plurality of sensors and a control device. The storage device is provided with a feeding port and a discharging port, and the baffle is arranged on the storage device and used for selectively opening or closing the discharging port. The push plate mechanism is arranged on the storage device and is used for pushing the materials out of the discharge port; the plurality of sensors are arranged on the storage device and are spaced from each other; andthe control device is electrically connected with the sensor and the push plate mechanism. By arranging the sensor, the distribution condition of putty in the material storage device is obtained, andwhen the materials are evenly distributed in the material storage device, the materials are discharged outwards. Therefore, the material can be more uniform when the material is supplied to the outside. Meanwhile, the embodim