Innovative application development kit based on Beidou chip

The utility model discloses an innovative application development kit based on a Beidou chip, which comprises a kit box body, the inner wall of the kit box body is movably connected with a foam board,and the top of the foam board is provided with a containing groove. And the inner wall of the accomm...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MA YIZE, WANG TAO, SUN YIDONG, MO HAOJIE, GOU ZUOKUN, GAO XINGYUAN, WU ENMING, LI MENGRAN, YU ZHOU, PENG JINGZHI, QIU YUANFAN, HUO PENGCHEN
Format: Patent
Sprache:chi ; eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:The utility model discloses an innovative application development kit based on a Beidou chip, which comprises a kit box body, the inner wall of the kit box body is movably connected with a foam board,and the top of the foam board is provided with a containing groove. And the inner wall of the accommodating groove is movably connected with a low-configuration sensor module, a middle-configurationsensor template, a high-configuration sensor template, a minimum system board, a minimum system expansion board, a short-circuit junction box and a connecting wire respectively. According to the utility model, the minimum system expansion board is electrically connected with the minimum system board, and the pins of the minimum system expansion board are respectively and electrically connected with the components in the low-configuration sensor module, the middle-configuration sensor template and the high-configuration sensor template through the Dupont lines. Through cooperative use of the modules in the low-configura