Mounting structure of semiconductor refrigeration device, cabinet body and refrigeration equipment
The utility model discloses a mounting structure of a semiconductor refrigeration device, a cabinet body and refrigeration equipment, the mounting structure of the semiconductor refrigeration device comprises a plate assembly, a first concave part is arranged on the front surface of the plate assemb...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a mounting structure of a semiconductor refrigeration device, a cabinet body and refrigeration equipment, the mounting structure of the semiconductor refrigeration device comprises a plate assembly, a first concave part is arranged on the front surface of the plate assembly, and a second concave part is arranged on the back surface of the plate assembly; the first concave part is communicated with the second concave part through a through hole, and the cold end of the semiconductor refrigeration device can penetrate through the through hole. According to the mounting structure of the semiconductor refrigeration device, the mounting operation is convenient, and the mounting efficiency is improved.
本实用新型公开了一种半导体制冷器件的安装结构、柜体及制冷设备,其中所述半导体制冷器件的安装结构包括板组件,所述板组件的正面开设有第一凹进部,所述板组件的背面开设有第二凹进部,所述第一凹进部与所述第二凹进部以通孔相连通,所述通孔用于供所述半导体制冷器件的冷端穿过。本实用新型中的半导体制冷器件的安装结构使得安装操作较为方便且提高了安装效率。 |
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