Base structure of low-frequency piezoelectric vibration device

The utility model relates to a base structure of a low-frequency piezoelectric vibration device, which comprises a base and a metal welding sealing ring arranged on the base, an inner cavity is arranged on the base, a plurality of dispensing platforms are distributed at the bottom of the inner cavity, and an arc-shaped fillet is chamfered at the position of the edge of each dispensing platform, which is used for carrying a chip. According to the utility model, when the low-frequency piezoelectric vibration device is used, enough space is provided for shear vibration of the chip in the thickness direction in the inner cavity of the base, the mechanical strength of combination of the chip and the base is enhanced, and the risk of failure of the low-frequency piezoelectric vibration device isreduced. 本实用新型涉及一种低频压电振动器件的基座结构，包括基座以及安装在基座上的金属焊封环，所述的基座上设置有内腔，该内腔底部分布有若干个点胶平台，每个点胶平台边缘用于搭载芯片的位置均倒有弧形圆角。本实用新型实现在使用低频压电振动器件时，芯片在基座内腔中发生厚度方向的剪切振动有足够的空间，增强芯片与基座结合的机械强度，降低低频压电振动器件失效的风险。