Tungsten-copper preset gold-tin solder heat sink

The utility model relates to a tungsten-copper preset gold-tin solder heat sink which comprises a tungsten-copper block, the tungsten-copper block is of a cuboid structure, a nickel layer is arrangedon the periphery of the tungsten-copper block, a gold layer is arranged outside the nickel layer, preset gold-tin solder is arranged at the upper end of the gold layer, and the preset gold-tin solderis arranged at the upper end of the gold layer in a layered electroplating mode. By arranging the preset gold-tin solder on a traditional tungsten-copper heat sink, the step of clamping the solder when the tungsten-copper heat sink is used is omitted, the solder does not need to be placed at the sintering position of a chip after being clamped, and the step process is simplified. 本实用新型涉及一种钨铜预置金锡焊料热沉，包括钨铜块，所述钨铜块为长方体结构，所述钨铜块的外周设置镍层，所述镍层外设置金层，其中，所述金层的上端设置预置金锡焊料，所述预置金锡焊料通过分层电镀的方式设置在所述金层上端。通过在传统的钨铜热沉上设置预置金锡焊料，省去了钨铜热沉使用时夹取焊料的步骤，且不需要夹取焊料后，要将焊料放到芯片烧结的位置，简化了步骤工艺。