TEC heat dissipation assembly for direct insertion type multi-element area array detector

The utility model discloses a TEC heat dissipation assembly used for a direct insertion type multi-element area array detector. The detector works in a space vacuum environment, and the TEC heat dissipation assembly utilizes heat conduction to control the temperature of the direct insertion type multi-element area array detector. The assembly comprises a TEC (thermoelectric cooler), a heat conduction copper sheet, an indium sheet, a metal flexible pressing frame and a metal supporting frame. The good plasticity, ductility and heat conductivity of the indium sheet are utilized, the TEC and theheat conduction copper sheet are combined, and through elaborate design, the heat dissipation assembly which is small in heat resistance, compact in structure and accurate in temperature control is jointly formed; according to the specially designed flexible metal pressing frame, large stress is unloaded through low-rigidity elastic deformation of the flexible part of the pressing frame, and the multi-element area array d