Heat dissipation device
A radiating device is suitable for a heating source and comprises a radiating fin and a liquid metal layer arranged between the heating source and the radiating fin. The cooling fin comprises a fin body facing the heating source and an anti-corrosion metal layer plated on the fin body. The liquid me...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | A radiating device is suitable for a heating source and comprises a radiating fin and a liquid metal layer arranged between the heating source and the radiating fin. The cooling fin comprises a fin body facing the heating source and an anti-corrosion metal layer plated on the fin body. The liquid metal layer is attached to the anti-corrosion metal layer of the cooling fin. The anti-corrosion metallayer is plated on the cooling fin; the anti-corrosion metal layer is used as a contact interface of the liquid metal layer; therefore, the metal material (copper or aluminum) radiating fin can be prevented from being corroded by the liquid metal layer, the liquid metal layer and the metal material (copper or aluminum) radiating fin can also be prevented from generating intermetallic compounds, and the stability of the liquid metal layer is effectively maintained.
一种散热装置,适用于发热源,所述散热装置包含散热片,及设置于所述发热源与所述散热片间的液态金属层。所述散热片包括面向所述发热源的片体,及镀在所述片体上的抗腐蚀金属层。所述液态金属层贴合所述散热片的抗腐蚀金属层。通过在所述散热片镀上所述抗腐蚀金属层,并以所述抗腐蚀金属层作为所述液态金属层的接触接口,可避免所述金 |
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