Heat dissipation device

A heat dissipation device comprises a composite plate with solder on the stamping surface to form a first plate body with a plurality of oblique grooves, oblique grooves with powder arranged in the first plate body, a first plate body and a second plate body which are overlapped and fixed, and a welding part for welding the first plate body and the second plate body, and the powder in the inclinedgroove of the first plate body is sintered into a capillary structure. 一种散热装置包含冲压表面带有焊料的一复合板材以形成具有多个斜向沟槽的一第一板体、粉体设置于第一板体的斜向沟槽、叠合并固定第一板体与一第二板体及焊接第一板体与第二板体，并将位于第一板体的斜向沟槽内的粉体烧结成一毛细结构。