Photosensitive chip, camera module and terminal

The embodiment of the invention discloses a photosensitive chip, a camera module and a terminal, and belongs to the technical field of optics. The photosensitive chip comprises a mounting surface; themounting surface is used for being connected with a circuit board of the camera module; at least one groove is formed in the installation face and used for containing the bonding layer so as to achieve connection between the photosensitive chip and the circuit board through the bonding layer. According to the embodiment of the invention, at least one groove is formed in the mounting surface of the photosensitive chip, so that the connection between the photosensitive chip and the circuit board can be realized through the bonding layer filled in the groove. When the photosensitive chip is connected with the circuit board through the bonding layer filled in the groove, on one hand, the photosensitive chip is not easy to deviate relative to the circuit board when the photosensitive chip is pressed or baked, and on t