Novel packaging pad for wafer-silicon element packaging

The utility model relates to a novel packaging pad for packaging a wafer silicon element, which aims to solve the problem of consumable items in the conventional packaging pad for the wafer silicon element and comprises a packaging pad body and a first subtractive material through hole formed in the...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ZHOU HAIQING, ZHAO ZONGQI
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS STORING TRANSPORTING
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Beschreibung
Zusammenfassung:	The utility model relates to a novel packaging pad for packaging a wafer silicon element, which aims to solve the problem of consumable items in the conventional packaging pad for the wafer silicon element and comprises a packaging pad body and a first subtractive material through hole formed in the middle of the packaging pad body in an up-and-down through manner, a second mounting through hole communicated with the first subtractive material through hole is formed in the middle of the first subtractive material through hole, and a first mounting through hole communicated with the first subtractive material through hole is formed in the side wall of the first subtractive material through hole; according to the packaging pad, the combined structure of the first subtractive material throughhole, the first mounting through hole and the second mounting through hole is formed in the packaging pad body, and due to the arrangement of the combined structure, materials used by the packaging pad can be reduced, so tha