Automatic centering V-shaped groove finding or edge cutting device for wafer

The utility model belongs to the field of hard and brittle material grinding and polishing equipment, and particularly relates to an automatic centering V-shaped groove finding or edge cutting devicefor a wafer. The device comprises a rack, a mounting base is arranged on the rack, and a bearing mounting base is arranged on the upper end face of the mounting base; a rotating spindle is arranged inthe bearing mounting seat through a bearing, the top end of the rotating spindle is connected with the turntable, and a rotating shaft is arranged in the rotating spindle through a bearing; a siliconwafer sucker is arranged at the top of the rotating shaft; the power device is arranged on the rack; the rotary positioning mechanism comprises a plurality of swing rods which are uniformly distributed below the turntable, and the middle part is fixedly arranged on the upper end surface of the bearing mounting seat through a connecting piece; a positioning guide wheel and a cam driven piece are arranged at the two ends of