PCB structure for improving reliability of dielectric filter
The utility model discloses a PCB (Printed Circuit Board) structure for improving the reliability of a dielectric filter, and aims to solve the technical problem of device failure caused by the fact that the surface of a ceramic filter is easily damaged by internal stress when the external temperatu...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a PCB (Printed Circuit Board) structure for improving the reliability of a dielectric filter, and aims to solve the technical problem of device failure caused by the fact that the surface of a ceramic filter is easily damaged by internal stress when the external temperature is changed due to welding spots of an existing PCB and the ceramic filter. The structure comprises a bonding pad, and a copper foil etching groove is formed in the periphery of the outer contour of the bonding pad in a shape matched with that of the bonding pad; the bonding pad is circular or square; wherein the copper foil etching groove is divided into more than two sections; and the copper foil etching grooves are strip-shaped quadrangles or polygons. Through the PCB structure, the stresseffect around the welding spots can be greatly reduced, the cracking risk of the ceramic filter body is reduced, and the overall reliability of the dielectric filter and the electronic product thereofis further enhanced.
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