Magnetron sputtering target with detection device

The utility model discloses a magnetron sputtering target with a detection device. The device comprises a vacuum cavity, a target material, a target seat, a connecting seat and a water-cooling back plate, a target seat is mounted in the center of the bottom of the vacuum cavity; connecting bases are...

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description The utility model discloses a magnetron sputtering target with a detection device. The device comprises a vacuum cavity, a target material, a target seat, a connecting seat and a water-cooling back plate, a target seat is mounted in the center of the bottom of the vacuum cavity; connecting bases are fixed to the two inner side walls of the bottom of the vacuum cavity correspondingly. One end of the connecting seat is in contact with the outer wall of the target seat; a mounting structure is arranged on the outer wall of the target seat below the connecting seat; a target material is installedat the top end in the target base, a water-cooling back plate is installed in the target base below the target material, circulation pipe grooves are formed in the two sides of the bottom end of the water-cooling back plate, the bottom ends of the circulation pipe grooves extend out of the target base, plugs are installed in the centers of the bottom ends of the circulation pipe grooves, and an alarm is installed in the c
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The device comprises a vacuum cavity, a target material, a target seat, a connecting seat and a water-cooling back plate, a target seat is mounted in the center of the bottom of the vacuum cavity; connecting bases are fixed to the two inner side walls of the bottom of the vacuum cavity correspondingly. One end of the connecting seat is in contact with the outer wall of the target seat; a mounting structure is arranged on the outer wall of the target seat below the connecting seat; a target material is installedat the top end in the target base, a water-cooling back plate is installed in the target base below the target material, circulation pipe grooves are formed in the two sides of the bottom end of the water-cooling back plate, the bottom ends of the circulation pipe grooves extend out of the target base, plugs are installed in the centers of the bottom ends of the circulation pipe grooves, and an alarm is installed in the c</description><language>chi ; eng</language><subject>CHEMICAL SURFACE TREATMENT ; CHEMISTRY ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL ; COATING MATERIAL WITH METALLIC MATERIAL ; COATING METALLIC MATERIAL ; DIFFUSION TREATMENT OF METALLIC MATERIAL ; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL ; MEASURING ; MEASURING ANGLES ; MEASURING AREAS ; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS ; MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS ; METALLURGY ; PHYSICS ; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION ; TESTING</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20201002&amp;DB=EPODOC&amp;CC=CN&amp;NR=211620607U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20201002&amp;DB=EPODOC&amp;CC=CN&amp;NR=211620607U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUN YANSHAN</creatorcontrib><title>Magnetron sputtering target with detection device</title><description>The utility model discloses a magnetron sputtering target with a detection device. 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language chi ; eng
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subjects CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
METALLURGY
PHYSICS
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
TESTING
title Magnetron sputtering target with detection device
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