Temperature adjusting device and cushion using same

The utility model discloses a temperature adjusting device. The device comprises a temperature adjusting assembly and a second conduction element, the temperature adjusting assembly comprises a semiconductor chilling plate, a first conduction element and a connecting piece. Wherein the semiconductor...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ZHU DANFEI, ZHANG ZESHENG, ZHANG ZHENGHAO
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The utility model discloses a temperature adjusting device. The device comprises a temperature adjusting assembly and a second conduction element, the temperature adjusting assembly comprises a semiconductor chilling plate, a first conduction element and a connecting piece. Wherein the semiconductor chilling plate is provided with a cold end or a hot end, the cold end or the hot end of the semiconductor chilling plate is attached to the first conduction element, the connecting piece is connected with the second conduction element in a rotating mode, the semiconductor chilling plate and/or thefirst conduction element are/is connected with the connecting piece, and the first conduction element is wrapped by a flexible pad. The utility model provides a temperature adjusting device which is good in temperature adjusting effect, reasonable in design and good in user experience. The utility model further provides a seat cushion which comprises the temperature adjusting device. 本实用新型公开了一种调温装置,包括调温组件和第二传导元件,所述调温组件包括半