Image sensor package

The utility model relates to an image sensor package. The image sensor package includes a substrate; an image sensor connected to the substrate; a film member disposed on the substrate and defining ahole for exposing an effective image pickup surface of the image sensor; a bonding wire connecting th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HONG JONGUL, WEE HYE-RAN, YOO DO-JAE, LEE SOON-KYO, YANG SI-JUNG
Format: Patent
Sprache:chi ; eng
Schlagworte:
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Beschreibung
Zusammenfassung:The utility model relates to an image sensor package. The image sensor package includes a substrate; an image sensor connected to the substrate; a film member disposed on the substrate and defining ahole for exposing an effective image pickup surface of the image sensor; a bonding wire connecting the image sensor to the substrate; and an optical filter attached to the film member. The membrane member includes at least one aperture therein, and at least a portion of the bonding wire is contained within the membrane member. According to the image sensor package disclosed by the utility model, the requirement of miniaturization can be met. 本申请涉及一种图像传感器封装,其包括衬底;连接到衬底的图像传感器;设置在衬底上并限定用于暴露图像传感器的有效图像拾取表面的孔的膜构件;将图像传感器连接到衬底的接合线;以及附接至膜构件的滤光器。膜构件包括位于其中的至少一个孔隙,并且接合线的至少一部分包含在膜构件内。根据本公开的图像传感器封装可以满足小型化的需求。