Bypass diode

Bypass diode. The utility model relates to the technical field of semiconductor packaging, in particular to a bypass diode packaging technology capable of improving current throughput. The bypass diode is compact and reasonable in structure, high in heat dissipation performance and good in performance. The lead frame structure comprises a lead frame, a chipset I and a pair of chipsets II which aresymmetrically arranged, the pair of chipsets II are fixedly arranged at the positions close to the edge of the lead frame respectively; the chipset I is fixedly arranged between the pair of chipsetsII; and the head part of the chipset I is positioned on one side of the tail part of the chipset II. The utility model has the characteristics of compact and reasonable structure, high heat dissipation, good performance and the like. 旁路二极管。本实用新型涉及半导体封装技术领域，尤其涉及提升电流通过量的旁路二极管的封装技术。提供了结构紧凑合理、散热性高、性能好的旁路二极管。包括引线框架、芯片组一和一对对称设置的芯片组二；一对所述芯片组二分别固定设置在靠近所述引线框架的边缘位置；所述芯片组一固定设置在一对所述芯片组二之间；所述芯片组一的头部位于所述芯片组二的尾部一侧。本实用新型具有结构紧凑合理、散热性高、性能好等