Temperature control assembly for keeping working temperature of chip
The utility model provides a temperature control assembly for keeping the working temperature of a chip and a temperature control method thereof, the temperature control assembly comprises a chip, a heater, a thermistor, an insulating substrate and an insulating thermal baffle, the chip is arranged...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model provides a temperature control assembly for keeping the working temperature of a chip and a temperature control method thereof, the temperature control assembly comprises a chip, a heater, a thermistor, an insulating substrate and an insulating thermal baffle, the chip is arranged on the insulating thermal baffle, and the heater and the thermistor are adhered to the outer part ofthe same side of the insulating substrate and are adhered to the chip through the insulating substrate. According to the utility model, a TEC temperature control scheme is abandoned, a temperature control method of heating by the heater and monitoring by the thermistor to keep the temperature stable is adopted, and meanwhile, the size and material design of the insulating and heat-insulating plate is combined, so that a chip application scene with higher requirement on position placement can be met, and the cost can be effectively reduced while the integration degree is improved.
本实用新型提供一种保持芯片工作温度的控温组件及其控温方法,控温组件包括芯片 |
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