Heat-conducting film for aluminum substrate and aluminum substrate

The utility model relates to a heat-conducting film for an aluminum substrate and the aluminum substrate. The heat-conducting film for the aluminum substrate is provided with a binding power enhancinglayer on at least one side of a heat-conducting base layer. Wherein the heat conduction base layer contains a glass fiber reinforced material, has good mechanical strength, can be directly laminatedwith an aluminum plate and a copper foil and then subjected to hot pressing, and is simple in process. The bonding force enhancement layer does not contain a glass fiber enhancement material and has relatively high bonding strength with a metal material, so that the bonding firmness with an aluminum plate and/or a copper foil is enhanced, and the problem that a component or a bonding pad falls offin a downstream process such as workpiece loading is avoided. 本实用新型涉及一种铝基板用导热胶片及铝基板，该铝基板用导热胶片在导热基层的至少一侧上设置有的粘结力增强层。其中，导热基层中含有玻璃纤维增强材料，具有较好的机械强度，可直接与铝板、铜箔叠合后热压，工艺简单。粘结力增强层中不含有玻璃纤维增强材料，具有较高的与金属材料的粘结强度，以增强与铝板和/或铜箔的粘结牢固性，避免在下游工序如上