SOD series high-power ultralow-capacitance electrostatic protection chip packaging structure

The utility model discloses an SOD series high-power ultralow-capacitance electrostatic protection chip packaging structure. The utility model relates to the technical field of electronic chips. The metal lead frame is arranged in the epoxy resin plastic package; pins of the metal lead frame are exposed out of the epoxy resin plastic package, the first electrostatic protection chip and the third electrostatic protection chip are electrically connected and fixed to the upper side and the lower side of the upper surface of the bonding pad on the left side of the metal lead frame, and the secondelectrostatic protection chip is electrically connected and fixed to the bonding pad on the right side of the metal lead frame. The third electrostatic protection chip is electrically connected with the lower side of the upper surface of the metal lead frame located on the right side through a metal wire. The first electrostatic protection chip and the second electrostatic protection chip are electrically connected throug