Heat dissipation plate for chip heat dissipation, server heat dissipation system and heating device
The utility model discloses a heat dissipation plate for chip heat dissipation, a server heat dissipation system and a heating device, which are characterized in that one end of the heat dissipation plate is blocked, and the other end of the heat dissipation plate is provided with a water inlet and...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a heat dissipation plate for chip heat dissipation, a server heat dissipation system and a heating device, which are characterized in that one end of the heat dissipation plate is blocked, and the other end of the heat dissipation plate is provided with a water inlet and a water outlet; pipelines in the heat dissipation plate comprise a plurality of branch water inlet pipelines of which one ends are communicated with the water inlet and a plurality of branch water outlet pipelines of which one ends are communicated with the water outlet, and the branch water inlet pipelines are communicated with the other ends of the branch water outlet pipelines through communicating pipelines; and the plurality of branch water inlet pipelines are parallel to the plurality of branch water outlet pipelines. The water flow path in the heat dissipation plate is short, the resistance is small, the heat dissipation efficiency is high, and the heat dissipation plate can be applied to heat dissipation of |
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