Novel LED structure adopting BT resin substrate

The utility model discloses a novel LED structure adopting a BT resin substrate. The novel LED structure comprises a first support leg, a second support leg, the BT resin substrate, a light-emitting chip, a gold wire and a packaging body. The BT resin substrate is arranged on the first support leg a...

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Bibliographische Detailangaben
Hauptverfasser: XIE PING'AN, XIE ANQUAN, ZHANG CHI
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model discloses a novel LED structure adopting a BT resin substrate. The novel LED structure comprises a first support leg, a second support leg, the BT resin substrate, a light-emitting chip, a gold wire and a packaging body. The BT resin substrate is arranged on the first support leg and the second support leg in a welding manner; wherein the light-emitting chip is arranged on the BTresin substrate in a die bonding manner; the packaging body covers the outer sides of the first support leg, the second support leg, the BT resin substrate, the light-emitting chip and the gold wirein a mould pressing manner, and the surface layer of the packaging body is a convex spherical surface; according to the technical scheme of the utility model, the light-emitting chip is die-bonded onto the BT resin substrate. According to the utility model, the BT resin substrate is welded on the support legs, so that the conventional production process of directly welding the light-emitting chipto the support legs is repl