Chip-on-film packaging structure and flexible circuit board thereof

The utility model discloses a chip-on-film packaging structure and a flexible circuit board thereof. The utility model relates to a thin film flip chip packaging structure. Chip and flexible circuit board, the flexible circuit board is respectively connected with the electronic substrate and the chip through a plurality of outer pins and a plurality of inner pins. The solder mask layer exposes theplurality of outer pins and the plurality of inner pins. Wherein the solder mask layer adjacent to the plurality of outer pins is provided with a plurality of convex parts and a plurality of concaveparts, a bending predetermined area is defined between the top end of each convex part and the bottom end of each concave part, and after the thin film flip chip packaging structure is electrically connected with the electronic substrate, the bending predetermined area is bent, so that the side line of the electronic substrate is vertically projected in the bending predetermined area. 本实用新型公开了一种薄膜覆晶封装结构及其软性电路板，其中所述的一种薄膜覆晶封