Antenna packaging structure

The utility model provides an antenna packaging structure. The antenna packaging structure comprises a rewiring layer, a first antenna layer, a first metal feeder column, a first packaging layer, a second antenna layer, a second metal feeder column, a second packaging layer, a third antenna layer, a semiconductor chip, a metal bump and a third packaging layer. According to the utility model, the semiconductor chip is protected based on the third packaging layer; the chip and the metal bumps are packaged at the same time; the stability of the packaging structure can be effectively improved; a multi-layer antenna structure is formed by a plurality of layers of metal feeder columns and a plurality of packaging layers. Reducing package size, the semiconductor chip, the rewiring layer, the antenna metal and other structures are arranged to be of a vertical arrangement structure, the conduction path between assemblies can be effectively shortened, better electrical performance and antenna performance are achieved,