Antenna packaging structure

The utility model provides an antenna packaging structure. The antenna packaging structure comprises a rewiring layer, a first antenna layer, a first metal feeder column, a first packaging layer, a second antenna layer, a second metal feeder column, a second packaging layer, a third antenna layer, a semiconductor chip, a metal bump and a third packaging layer. According to the utility model, the semiconductor chip is protected based on the third packaging layer; the chip and the metal bumps are packaged at the same time; the stability of the packaging structure can be effectively improved; a hole is formed in the packaging layer and then a metal convex block is formed; simplified process, the preparation of the metal convex block is facilitated; a multi-layer antenna structure is formed bya plurality of layers of metal feeder columns and a plurality of packaging layers. The packaging size is reduced, the signal receiving capability is enhanced, the signal receiving bandwidth is expanded, the bottom filling la