Wave soldering furnace temperature adjusting device

The utility model discloses a temperature adjusting device of a wave soldering furnace. Connection with wave soldering furnace, the device comprises a cooling metal pipeline and a cooling device, thecooling device is located outside the wave soldering furnace. The cooling metal pipeline is located i...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	TAN RONGTAO, HUANG KAIXIU, LI LIN, PAN GUOJUN
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The utility model discloses a temperature adjusting device of a wave soldering furnace. Connection with wave soldering furnace, the device comprises a cooling metal pipeline and a cooling device, thecooling device is located outside the wave soldering furnace. The cooling metal pipeline is located in the wave soldering furnace. The cooling metal pipeline is connected with the cooling device; thecooling device comprises a first sealing cavity, a second sealing cavity, a liquid nitrogen container and a gas compressor. The liquid nitrogen container is arranged in the first sealing cavity; the gas compressor is arranged in the second sealing cavity; wherein the first sealing cavity and the second sealing cavity are not communicated with each other, one end of the cooling metal pipeline penetrates through the wall of the wave soldering furnace and is connected with the liquid nitrogen container, the other end of the cooling metal pipeline penetrates through the wall of the wave solderingfurnace and is connected wi