Automatic retracting and releasing ejection mechanism for switch mold
The utility model discloses an automatic retracting and releasing ejection mechanism for a switch mold. The die comprises a lower die holder, a heat dissipation ejection mechanism is mounted at the bottom end of the lower die base; the bottom end face of the heat dissipation ejection mechanism is co...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses an automatic retracting and releasing ejection mechanism for a switch mold. The die comprises a lower die holder, a heat dissipation ejection mechanism is mounted at the bottom end of the lower die base; the bottom end face of the heat dissipation ejection mechanism is connected with a supporting base. Guide inserting holes are formed in the four corners of the lower die base; a clamping frame is connected into the lower die base in a clamped mode. A mold core plate is arranged in the middle of the clamping frame; the heat dissipation ejection mechanism comprises atelescopic spring, a fixed frame and a heat dissipation groove; the heat dissipation grooves are symmetrically formed in the two sides of the fixing frame. The telescopic springs are uniformly and fixedly mounted in the fixed frame; limiting columns are evenly and symmetrically installed on the bottom end face of the mold core plate, a lower mold core is arranged on the upper end face of the moldcore plate, the limiting c |
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