Device for laminating semiconductor wafer and ceramic disc in bubble-free manner by vacuumizing and pressurizing

The utility model relates to the technical field of semiconductor material processing, and especially relates to a device for vacuum-pumping pressurization bubble-free lamination of a semiconductor wafer and a ceramic disc. The device comprises a closed cavity consisting of an upper housing and a lower housing, the lower housing is fixedly connected with the fixed plate, and is also connected withan external vacuum pump; the upper housing is connected with a swing arm, the swing arm is connected with a vacuum chamber cylinder through a hinge arranged on the fixed plate, and a vacuum sensor isarranged on the upper housing; a wafer supporting frame is arranged in the center in the lower housing, a wafer supporting plate is arranged on the top surface of the wafer supporting frame, and a bearing seat is arranged in the center of the bottom of the wafer supporting frame; the bearing is arranged in the bearing seat, and a spring is also arranged between the bearing seat and the top surface of the wafer support fra