RESIN MULTILAYER SUBSTRATE

A resin multilayer substrate (101) is provided with: a laminate (1) in which a plurality of resin layers (2) are laminated; a member (3); one or more first-type conductor patterns (7); and one or moresecond-type conductor patterns (8). Gaps between the resin layers (2) are arranged in the laminated body (1); at least a portion of the outer contour line of each of the first type of conductor patterns (7) is located at a position overlapping the member (3). The outer lines of the second type of conductor patterns (8) are located at positions that do not overlap the component (3) at all. A resinportion (15) is disposed along a portion of the outer lines of the first type of conductor patterns (7) overlapping the member (3) so as to be adjacent to the outside of the first type of conductor patterns (7). The resin part is derived from a resin paste that is mainly composed of a powder of a thermoplastic resin, and the resin part (15) is not disposed in a portion along the outer contour line of each of the second ty