Packaging structure for packaging module antenna

The utility model relates to a packaging structure of a packaging module antenna. The packaging structure comprises a chip, a lead frame and a plastic packaging material, the chip is welded on the lead frame in an inverted manner. Wherein the lead frame comprises a plurality of pins and is bent upwards to form a horizontal antenna, the upper surface of the antenna is flush with the upper surface of the chip or higher than the upper surface of the chip, the plastic package material carries out plastic package on the chip and the lead frame, and an opening is further machined in the plastic package material above the antenna, so that the upper surface of the antenna is exposed. The packaging structure adopts a lead frame with a special structure. Pin, a horizontal antenna pre-processing layer is also bent upwards; as a raw material for later processing of the antenna, the antenna pre-processing layer is fixed on the plastic package material, so that the antenna shape can be etched on theantenna pre-processing l