An outer cover substrate for seismic instrument electronics article

The utility model relates to an outer covering substrate for an electronic article of a seismic instrument. Including a base, the top of the base is fixedly connected with a damping spring. The top ofthe damping spring is fixedly connected with a connecting plate; the top of the connecting plate is...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	ZHENG YONGTONG, LIU LICHENG, CHEN MEIMEI, LIN HUIQING, ZHENG ZHIHONG, WU LIHUA, LAI JIANSHEN, QUAN JIANJUN, CHEN SHANHUA, LIN ZHENGCHANG
Format:	Patent
Sprache:	chi ; eng
Schlagworte:	BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MEANS FOR DAMPING VIBRATION MECHANICAL ENGINEERING PRINTED CIRCUITS SHOCK-ABSORBERS SPRINGS THERMAL INSULATION IN GENERAL WEAPONS
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Beschreibung
Zusammenfassung:	The utility model relates to an outer covering substrate for an electronic article of a seismic instrument. Including a base, the top of the base is fixedly connected with a damping spring. The top ofthe damping spring is fixedly connected with a connecting plate; the top of the connecting plate is fixedly connected with a supporting column. The top of the supporting column is fixedly connected with a mounting plate. Ventilation openings are formed in the two sides between the mounting plate and the connecting plate; a cooling fan is arranged on the mounting plate; brackets are fixedly connected to the two ends of the mounting plate; a first base plate is arranged at the top of the mounting plate; the first substrate is arranged between the brackets; by arranging the heat conduction layerand the heat conduction holes, heat generated by an electronic product in the substrate in use is discharged, heat dissipation can be enhanced through the heat dissipation fan, the bottom of the connecting plate is provided w