FP/QFP chip tinning device

The utility model discloses a tin coating device for an FP/QFP chip. The tin coating device comprises a lifting structure, a tin coating angle control structure and a chip quick-change clamp structure, the tinning angle control structure controls the tinning angle through the extending length of the tinning angle control rod. Wherein the chip quick-change clamp is provided with a clamping structure with a convex edge at the front end, the clamping structure can avoid a chip pin and clamp a shoulder wide part of the chip pin, a quick-change clamp positioning pin and a horizontal quick-change clamp guide groove are designed on the rear side, and one pin and one groove are used for positioning; the tinning angle control structure is in a three-rod hinged mode, and the tinning limit position is controlled by a tinning positioning block with the adjustable height. Wherein the tinning positioning block is a height-adjustable hard rubber block, the position of a chip tinning pin is close to 1/2 of the height range o