Semiconductor device packaging device

The utility model discloses a semiconductor device packaging device. The packaging structure comprises an upper cover plate, a lower cover plate, a lower groove, an upper groove, a packaging substrate, a chip and packaging glue, a lower cover plate is arranged below the upper cover plate; an upper groove is embedded in the lower part of the upper cover plate; a lower groove is embedded in the inner surface of the upper part of the lower cover plate; a packaging substrate is arranged at the upper part of the interior of the lower groove; a chip is fixed to the surface of the packaging substrate, an injection molding hole is formed in one side of the lower cover plate, a reserved groove is reserved in the surface of the bottom of the injection molding hole, the top end of a pull rod penetrating through the middle of the reserved groove is connected with a piston head, and packaging glue placed in the upper groove is arranged at the top end of the piston head. According to the semiconductor device packaging devi