Substrate cutting device
The substrate cutting device comprises a transferring unit, a cutting unit and a cutting unit, wherein the transferring unit transfers a substrate; and a flipping unit flipping the substrate transferred by the transfer unit, the flipping unit including: a first selection module and a second selectio...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The substrate cutting device comprises a transferring unit, a cutting unit and a cutting unit, wherein the transferring unit transfers a substrate; and a flipping unit flipping the substrate transferred by the transfer unit, the flipping unit including: a first selection module and a second selection module spaced apart from each other; the selection lifting module enables the first selection module and the second selection module to move in the Z-axis direction; and selecting a rotation module, the first selection module and the second selection module rotate by taking an axis orthogonal to aZ axis as a center; wherein the first selection module and the second selection module are respectively provided with a plurality of adsorption pads for adsorbing the substrate, and the adsorption pads arranged on the first selection module and the adsorption pads arranged on the second selection module are arranged in opposite directions.
根据本实用新型的基板切割装置包括:移送单元,移送基板;以及翻转单元,使通过所述移送单元移送的所述基板翻转,所述翻转单元包括:第一选择模块和第二选择模块,彼此间隔开地 |
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