Chip type laminated balun filter
The utility model discloses a chip type laminated balun filter which comprises a substrate, a grounding pole plate, a first-layer plate, a chip electrode, a copper coil, a first conductive column, a second conductive column, a second-layer plate, a third-layer plate, a third conductive column, a fou...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model discloses a chip type laminated balun filter which comprises a substrate, a grounding pole plate, a first-layer plate, a chip electrode, a copper coil, a first conductive column, a second conductive column, a second-layer plate, a third-layer plate, a third conductive column, a fourth-layer plate, a fifth-layer plate, a grounding metal strip, a fourth conductive column, a sixth-layer plate, an input electrode, a grounding electrode, an output electrode and a direction indication position. The beneficial effects of the utility model are that: the utility model discloses: the beneficial effect is: a circle of closed copper coil is fixed on the surface of the sheet electrode on the surface of the layer of plate along the edge; two centrosymmetric inductance coils are formed;spurious signals outside the working frequency band can be well suppressed; the sheet-shaped electrodes on the second-layer plate and the third-layer plate correspond to each other up and down and are distributed in a left-r |
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