Heat dissipation mechanism of silicon carbide power device

The utility model discloses a heat dissipation mechanism of a silicon carbide power device, and belongs to the technical field of silicon carbide devices. The utility model discloses a heat dissipation mechanism of a silicon carbide power device. The silicon carbide power device comprises a silicon carbide power device body, bottom plates and connecting parts. Wherein the silicon carbide power device main body is connected with the bottom plate through the connecting part, one side, far away from the silicon carbide power device main body, of the bottom plate is connected with two groups of clamping type connecting pipes, the outer walls of the clamping type connecting pipes are sleeved with uniformly distributed heat dissipation fins, and a gap is formed between every two adjacent heat dissipation fins; according to the utility model, the connection flexibility of the heat dissipation fins is improved, the heat dissipation fins are convenient to disassemble and clean regularly, the stable heat dissipation pe