Multilayer ceramic substrate with high current-carrying capacity

The utility model discloses a multilayer ceramic substrate with high current-carrying capability. A continuous through groove is formed in the raw ceramic chip; the continuous through grooves are filled with the conductors for wiring, so that the wiring thickness of the conductors is greatly increased, the current-carrying capacity of the multilayer ceramic substrate is obviously enhanced, more high-power circuit products can be miniaturized, planarized and integrated by adopting the multilayer wiring ceramic substrate, and the integration level of the circuit products is improved. 本实用新型公开了一种高载流能力多层陶瓷基板，在生瓷片上设有连续贯通槽，在所述连续贯通槽内填充导体进行布线，大大增加了导体布线厚度，使多层陶瓷基板的载流能力明显增强，从而使得更多较大功率电路产品可以采用多层布线陶瓷基板实现小型化、平面化和集成化，提高了该类电路产品的集成度。