Turnover mechanism

The utility model discloses a turnover mechanism which comprises a base plate, flat films are arranged on the upper face and the lower face of the base plate, a plurality of through holes penetratingthrough the upper face and the lower face of the base plate are formed in the base plate, and the through holes extend and penetrate through the films. Different from the prior art, according to the technical scheme, due to the fact that the film is arranged, the surface of the hard SiC substrate can be prevented from making direct contact with the wafer, and the wafer is prevented from being damaged. Meanwhile, due to the arrangement of the film, the friction force with the wafer can be increased, and the wafer is prevented from slipping off. The substrate can be made of other materials, theSiC substrate does not need to be occupied, and the cost is also reduced. 本实用新型公开一种翻转机构，其中一种翻转机构包括基板，基板上下面的一面上设置有平整的膜，基板内设置有多个贯穿基板上下面的通孔，所述通孔延伸并贯穿所述膜。区别于现有技术，上述技术方案由于设置有膜，可以避免坚硬的SiC基板表面直接与晶圆接触，避免损伤晶圆。同时由于膜的设置，可以增加与晶圆的摩擦力，避免晶圆滑