Liquid metal printer and welding mechanism thereof
The utility model discloses a liquid metal printer and a welding mechanism thereof, and the welding mechanism comprises an extrusion molding mechanism which moves along the vertical direction and is used for extruding unit mass of welding flux to the surface of a base material right below the extrus...
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| creator | YAN QIZHEN |
| description | The utility model discloses a liquid metal printer and a welding mechanism thereof, and the welding mechanism comprises an extrusion molding mechanism which moves along the vertical direction and is used for extruding unit mass of welding flux to the surface of a base material right below the extrusion molding mechanism; wherein the solder is a metal mixture which is viscous at normal temperature;and the shaping pen moves along the vertical direction and the horizontal direction and is used for pushing the welding flux extruded on the surface of the base material and enabling the welding fluxto wrap the connection point between the pin of the patch element and the liquid metal circuit on the surface of the base material in a certain shape. According to the utility model, the conductive slurry which is viscous at normal temperature is used as the solder; the solder is used for plugging the joint of the liquid metal circuit and the element pin, so that the solder can be used as a conductive connecting agent to |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_CN209488937UU</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>CN209488937UU</sourcerecordid><originalsourceid>FETCH-epo_espacenet_CN209488937UU3</originalsourceid><addsrcrecordid>eNrjZDDyySwszUxRyE0tScxRKCjKzCtJLVJIzEtRKE_NScnMSwfKJGck5mUW5yqUZKQWpean8TCwpiXmFKfyQmluBiU31xBnD93Ugvz41OKCxOTUvNSSeGc_IwNLEwsLS2Pz0FBjohQBAC3GLQ8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Liquid metal printer and welding mechanism thereof</title><source>esp@cenet</source><creator>YAN QIZHEN</creator><creatorcontrib>YAN QIZHEN</creatorcontrib><description>The utility model discloses a liquid metal printer and a welding mechanism thereof, and the welding mechanism comprises an extrusion molding mechanism which moves along the vertical direction and is used for extruding unit mass of welding flux to the surface of a base material right below the extrusion molding mechanism; wherein the solder is a metal mixture which is viscous at normal temperature;and the shaping pen moves along the vertical direction and the horizontal direction and is used for pushing the welding flux extruded on the surface of the base material and enabling the welding fluxto wrap the connection point between the pin of the patch element and the liquid metal circuit on the surface of the base material in a certain shape. According to the utility model, the conductive slurry which is viscous at normal temperature is used as the solder; the solder is used for plugging the joint of the liquid metal circuit and the element pin, so that the solder can be used as a conductive connecting agent to</description><language>chi ; eng</language><subject>ADDITIVE MANUFACTURING TECHNOLOGY ; ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CASTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MAKING METALLIC POWDER ; MANUFACTURE OF ARTICLES FROM METALLIC POWDER ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; POWDER METALLURGY ; PRINTED CIRCUITS ; TRANSPORTING ; WORKING METALLIC POWDER</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191011&DB=EPODOC&CC=CN&NR=209488937U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191011&DB=EPODOC&CC=CN&NR=209488937U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YAN QIZHEN</creatorcontrib><title>Liquid metal printer and welding mechanism thereof</title><description>The utility model discloses a liquid metal printer and a welding mechanism thereof, and the welding mechanism comprises an extrusion molding mechanism which moves along the vertical direction and is used for extruding unit mass of welding flux to the surface of a base material right below the extrusion molding mechanism; wherein the solder is a metal mixture which is viscous at normal temperature;and the shaping pen moves along the vertical direction and the horizontal direction and is used for pushing the welding flux extruded on the surface of the base material and enabling the welding fluxto wrap the connection point between the pin of the patch element and the liquid metal circuit on the surface of the base material in a certain shape. According to the utility model, the conductive slurry which is viscous at normal temperature is used as the solder; the solder is used for plugging the joint of the liquid metal circuit and the element pin, so that the solder can be used as a conductive connecting agent to</description><subject>ADDITIVE MANUFACTURING TECHNOLOGY</subject><subject>ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CASTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MAKING METALLIC POWDER</subject><subject>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>POWDER METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>TRANSPORTING</subject><subject>WORKING METALLIC POWDER</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDyySwszUxRyE0tScxRKCjKzCtJLVJIzEtRKE_NScnMSwfKJGck5mUW5yqUZKQWpean8TCwpiXmFKfyQmluBiU31xBnD93Ugvz41OKCxOTUvNSSeGc_IwNLEwsLS2Pz0FBjohQBAC3GLQ8</recordid><startdate>20191011</startdate><enddate>20191011</enddate><creator>YAN QIZHEN</creator><scope>EVB</scope></search><sort><creationdate>20191011</creationdate><title>Liquid metal printer and welding mechanism thereof</title><author>YAN QIZHEN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_CN209488937UU3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>chi ; eng</language><creationdate>2019</creationdate><topic>ADDITIVE MANUFACTURING TECHNOLOGY</topic><topic>ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CASTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MAKING METALLIC POWDER</topic><topic>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>POWDER METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>TRANSPORTING</topic><topic>WORKING METALLIC POWDER</topic><toplevel>online_resources</toplevel><creatorcontrib>YAN QIZHEN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YAN QIZHEN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Liquid metal printer and welding mechanism thereof</title><date>2019-10-11</date><risdate>2019</risdate><abstract>The utility model discloses a liquid metal printer and a welding mechanism thereof, and the welding mechanism comprises an extrusion molding mechanism which moves along the vertical direction and is used for extruding unit mass of welding flux to the surface of a base material right below the extrusion molding mechanism; wherein the solder is a metal mixture which is viscous at normal temperature;and the shaping pen moves along the vertical direction and the horizontal direction and is used for pushing the welding flux extruded on the surface of the base material and enabling the welding fluxto wrap the connection point between the pin of the patch element and the liquid metal circuit on the surface of the base material in a certain shape. According to the utility model, the conductive slurry which is viscous at normal temperature is used as the solder; the solder is used for plugging the joint of the liquid metal circuit and the element pin, so that the solder can be used as a conductive connecting agent to</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | ADDITIVE MANUFACTURING TECHNOLOGY ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CASTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS POWDER METALLURGY PRINTED CIRCUITS TRANSPORTING WORKING METALLIC POWDER |
| title | Liquid metal printer and welding mechanism thereof |
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