Liquid metal printer and welding mechanism thereof

The utility model discloses a liquid metal printer and a welding mechanism thereof, and the welding mechanism comprises an extrusion molding mechanism which moves along the vertical direction and is used for extruding unit mass of welding flux to the surface of a base material right below the extrus...

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Bibliographische Detailangaben
1. Verfasser: YAN QIZHEN
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The utility model discloses a liquid metal printer and a welding mechanism thereof, and the welding mechanism comprises an extrusion molding mechanism which moves along the vertical direction and is used for extruding unit mass of welding flux to the surface of a base material right below the extrusion molding mechanism; wherein the solder is a metal mixture which is viscous at normal temperature;and the shaping pen moves along the vertical direction and the horizontal direction and is used for pushing the welding flux extruded on the surface of the base material and enabling the welding fluxto wrap the connection point between the pin of the patch element and the liquid metal circuit on the surface of the base material in a certain shape. According to the utility model, the conductive slurry which is viscous at normal temperature is used as the solder; the solder is used for plugging the joint of the liquid metal circuit and the element pin, so that the solder can be used as a conductive connecting agent to