And steel mesh is used for printing solder paste
The utility model relates to a steel mesh for printing solder paste, the steel mesh is at least provided with two printing holes which are symmetrically arranged relative to a first symmetry axis, thetwo printing holes correspond to two bonding pads on a printed circuit board, and each printing hole...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model relates to a steel mesh for printing solder paste, the steel mesh is at least provided with two printing holes which are symmetrically arranged relative to a first symmetry axis, thetwo printing holes correspond to two bonding pads on a printed circuit board, and each printing hole is in a convex pentagon shape or a concave pentagon shape. Through the above technical scheme, theabove technical scheme is adopted, the area of the printing holes in the steel mesh is reduced; the area of the printing holes is smaller than the area of the corresponding bonding pads, the amount of solder paste on the printed circuit board is reduced, especially the amount of solder paste below the pins of the chip component is reduced, and therefore the possibility of generating solder ballsis effectively reduced, it can be guaranteed that the wettability of the solder paste is high, and the ideal welding effect can be achieved.
本公开涉及一种用于印刷锡膏的钢网,所述钢网上至少开设有关于第一对称轴对称布置的两个印刷孔,所述两个印刷孔对应于印刷电路板上的两个焊盘,每个印刷孔呈凸五边形或凹五边形。通过上 |
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