Semiconductor packaging substrate
The utility model discloses a semiconductor packaging substrate. The device comprises a bearing plate, a cover plate and a substrate, the upper part of the bearing plate is connected with the bottom end of a chip through an insulating adhesive; the lower part of the bearing plate is uniformly coated...
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| Format: | Patent |
| Sprache: | chi ; eng |
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| Zusammenfassung: | The utility model discloses a semiconductor packaging substrate. The device comprises a bearing plate, a cover plate and a substrate, the upper part of the bearing plate is connected with the bottom end of a chip through an insulating adhesive; the lower part of the bearing plate is uniformly coated with a heat dissipation layer; a metal wiring layer is arranged in the bearing plate; the bearing plate is connected with the chip through the metal wiring layer; a mounting hole is formed in the outer side of the bearing plate; the left end and the right end of the bearing plate are both connectedwith metal wires, the cover plate is arranged above the bearing plate, the outer side of the cover plate is connected with a sealing column, the base plate is arranged below the bearing plate, the outer side of the base plate is connected with a connecting column, and the top end of the connecting column is provided with a clamping hole. According to the semiconductor packaging substrate, the substrate can be suspended, |
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