Circuit board and computing device

The embodiment of the utility model provides a circuit board and computing equipment. The circuit board comprises a PCB and two groups of chips arranged on the PCB, wherein the first group of chips are arranged on a first surface of the PCB, and the second group of chips are arranged on a second sur...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: XIU HONGYU
Format: Patent
Sprache:chi ; eng
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Beschreibung
Zusammenfassung:The embodiment of the utility model provides a circuit board and computing equipment. The circuit board comprises a PCB and two groups of chips arranged on the PCB, wherein the first group of chips are arranged on a first surface of the PCB, and the second group of chips are arranged on a second surface opposite to the first surface of the PCB; wherein a first radiator is arranged on the first group of chips, and a second radiator is arranged on the second group of chips. According to the embodiment of the utility model, reasonable planning and layout of the chips on the PCB are realized, so that the effective heat dissipation space of the circuit board is expanded to the front and back sides from the space only on the front side of the single board, the volume power density of the circuit board is reduced, and the overall heat dissipation efficiency of the circuit board is improved. 本公开实施例提出一种电路板及计算设备,该电路板包括PCB板以及设置在所述PCB板上的两组芯片;第一组芯片设置在所述PCB板的第一面,第二组芯片设置在与所述PCB板的第一面相对的第二面;其中,所述第一组芯片上设置有第一散热器,所述第二组芯片上设置有第二散热