Thin plastic polishing tools for CMP applications
The present disclosure relates to thin plastic polishing tools for CMP applications. The present disclosure provides a method and apparatus for polishing a substrate, including a polishing implement including a polymeric sheet having a raised surface texture formed on a surface of the polymeric shee...
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| creator | GREGORY E. MENK YOU WANG EKATERINA MIKHAYLICHENKO VEERA RAGHAVA REDDY KAKIREDDY ROBERT D. TOLLES HUYEN KAREN TRAN JAY GURUSAMY ERIC DAVEY FRED C. REDEKER |
| description | The present disclosure relates to thin plastic polishing tools for CMP applications. The present disclosure provides a method and apparatus for polishing a substrate, including a polishing implement including a polymeric sheet having a raised surface texture formed on a surface of the polymeric sheet. According to one or more implementations of the present disclosure, an improved polishing implement has been developed that does not require abrasive pad dressing. In some implementations of the present disclosure, the improved polishing implement includes a polymeric sheet having a polishing surface with raised surface textures or "microscopic features" and/or a plurality of grooves or "macroscopic features" formed in the polishing surface. In some implementations, the raised surface textureis impressed, etched, machined, or otherwise formed in the polishing surface prior to installation in a polishing system and use of the improved polishing implement. In one implementation, the raisedfeatures have a height wi |
| format | Patent |
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TOLLES ; HUYEN KAREN TRAN ; JAY GURUSAMY ; ERIC DAVEY ; FRED C. REDEKER</creatorcontrib><description>The present disclosure relates to thin plastic polishing tools for CMP applications. The present disclosure provides a method and apparatus for polishing a substrate, including a polishing implement including a polymeric sheet having a raised surface texture formed on a surface of the polymeric sheet. According to one or more implementations of the present disclosure, an improved polishing implement has been developed that does not require abrasive pad dressing. In some implementations of the present disclosure, the improved polishing implement includes a polymeric sheet having a polishing surface with raised surface textures or "microscopic features" and/or a plurality of grooves or "macroscopic features" formed in the polishing surface. In some implementations, the raised surface textureis impressed, etched, machined, or otherwise formed in the polishing surface prior to installation in a polishing system and use of the improved polishing implement. In one implementation, the raisedfeatures have a height wi</description><language>chi ; eng</language><subject>BASIC ELECTRIC ELEMENTS ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190607&DB=EPODOC&CC=CN&NR=208945894U$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190607&DB=EPODOC&CC=CN&NR=208945894U$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GREGORY E. MENK</creatorcontrib><creatorcontrib>YOU WANG</creatorcontrib><creatorcontrib>EKATERINA MIKHAYLICHENKO</creatorcontrib><creatorcontrib>VEERA RAGHAVA REDDY KAKIREDDY</creatorcontrib><creatorcontrib>ROBERT D. TOLLES</creatorcontrib><creatorcontrib>HUYEN KAREN TRAN</creatorcontrib><creatorcontrib>JAY GURUSAMY</creatorcontrib><creatorcontrib>ERIC DAVEY</creatorcontrib><creatorcontrib>FRED C. REDEKER</creatorcontrib><title>Thin plastic polishing tools for CMP applications</title><description>The present disclosure relates to thin plastic polishing tools for CMP applications. The present disclosure provides a method and apparatus for polishing a substrate, including a polishing implement including a polymeric sheet having a raised surface texture formed on a surface of the polymeric sheet. According to one or more implementations of the present disclosure, an improved polishing implement has been developed that does not require abrasive pad dressing. In some implementations of the present disclosure, the improved polishing implement includes a polymeric sheet having a polishing surface with raised surface textures or "microscopic features" and/or a plurality of grooves or "macroscopic features" formed in the polishing surface. In some implementations, the raised surface textureis impressed, etched, machined, or otherwise formed in the polishing surface prior to installation in a polishing system and use of the improved polishing implement. 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TOLLES</creatorcontrib><creatorcontrib>HUYEN KAREN TRAN</creatorcontrib><creatorcontrib>JAY GURUSAMY</creatorcontrib><creatorcontrib>ERIC DAVEY</creatorcontrib><creatorcontrib>FRED C. REDEKER</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GREGORY E. MENK</au><au>YOU WANG</au><au>EKATERINA MIKHAYLICHENKO</au><au>VEERA RAGHAVA REDDY KAKIREDDY</au><au>ROBERT D. TOLLES</au><au>HUYEN KAREN TRAN</au><au>JAY GURUSAMY</au><au>ERIC DAVEY</au><au>FRED C. REDEKER</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Thin plastic polishing tools for CMP applications</title><date>2019-06-07</date><risdate>2019</risdate><abstract>The present disclosure relates to thin plastic polishing tools for CMP applications. The present disclosure provides a method and apparatus for polishing a substrate, including a polishing implement including a polymeric sheet having a raised surface texture formed on a surface of the polymeric sheet. According to one or more implementations of the present disclosure, an improved polishing implement has been developed that does not require abrasive pad dressing. In some implementations of the present disclosure, the improved polishing implement includes a polymeric sheet having a polishing surface with raised surface textures or "microscopic features" and/or a plurality of grooves or "macroscopic features" formed in the polishing surface. In some implementations, the raised surface textureis impressed, etched, machined, or otherwise formed in the polishing surface prior to installation in a polishing system and use of the improved polishing implement. In one implementation, the raisedfeatures have a height wi</abstract><oa>free_for_read</oa></addata></record> |
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| language | chi ; eng |
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| subjects | BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING |
| title | Thin plastic polishing tools for CMP applications |
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