Thin plastic polishing tools for CMP applications

The present disclosure relates to thin plastic polishing tools for CMP applications. The present disclosure provides a method and apparatus for polishing a substrate, including a polishing implement including a polymeric sheet having a raised surface texture formed on a surface of the polymeric sheet. According to one or more implementations of the present disclosure, an improved polishing implement has been developed that does not require abrasive pad dressing. In some implementations of the present disclosure, the improved polishing implement includes a polymeric sheet having a polishing surface with raised surface textures or "microscopic features" and/or a plurality of grooves or "macroscopic features" formed in the polishing surface. In some implementations, the raised surface textureis impressed, etched, machined, or otherwise formed in the polishing surface prior to installation in a polishing system and use of the improved polishing implement. In one implementation, the raisedfeatures have a height wi