Silicon wafer texturing device
The utility model provides a silicon wafer texturing device which comprises a frame body, a liquid conveying device and a spraying device, and the frame body is provided with a groove; the infusion device is fixed on the frame body; the spraying device is arranged above the groove, the two ends of t...
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Format: | Patent |
Sprache: | chi ; eng |
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Zusammenfassung: | The utility model provides a silicon wafer texturing device which comprises a frame body, a liquid conveying device and a spraying device, and the frame body is provided with a groove; the infusion device is fixed on the frame body; the spraying device is arranged above the groove, the two ends of the spraying device are communicated with the two ends of the liquid conveying device respectively, aplurality of spraying holes are formed in the spraying device at equal intervals, and the extending direction of the spraying device is perpendicular to the moving direction of the silicon wafer. Thesilicon wafer texturing device provided by the utility model overcomes the defects that the silicon wafers on different rail stations are non-uniform in thinning amount and not in-place in reaction.
本实用新型提供一种硅片制绒装置,包括:架体、输液装置和喷淋装置,架体具有凹槽;输液装置固定在架体上;喷淋装置设置在凹槽上方,两端分别与输液装置的两端连通并具有多个间隔均匀的喷淋孔,喷淋装置的延伸方向与硅片的运动方向互相垂直。本实用新型提供的硅片制绒装置克服了不同轨道工位上的硅片的减薄量不均匀、反应不到位的缺陷。 |
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