Package

The utility model relates to a package. Integrated circuit chip is installed on the front surface of backup pad. Right rear seal cover is installed the backup pad. Sealed lid includes: antetheca and outer leg, outer leg have at least in part towards the end edge in the peripheral region of backup pad. The cavity that backup pad and sealed lid limitd integrated circuit chip and be located. In orderto install sealed lid, gluey integument inserts between the end edge of the outer leg of peripheral region and sealed lid. The peripheral surface of sealed lid includes from the recess of end edge extension that this recess exposes the partly of gluey pearl partly. As the first differential hardening of attaching the step of connecing and carrying out the glue of groove. Then carry out the further sclerosis of gluey remainder. Provision of electronic package's improvement scheme from this. 本申请涉及封装体。集成电路芯片被安装在支撑板的前表面上。然后密封盖被安装到支撑板。密封盖包括：前壁和外围壁，外围壁具有至少部分地面向支撑板的外围区域的末端边缘。支撑板和密封盖界定集成电路芯片所位于的腔室。为了安装密封盖，胶珠被插入在外围区域与密封盖的外围壁的